论文信息 - An analysis of the creep of hot pressed silicon nitride in bending

An analysis of the creep of hot pressed silicon nitride in bending

The creep behaviour of hot pressed silicon nitride is investigated in four-point-bend tests at temperatures of about 1200° C. By use of appropriate creep laws for the primary creep range as well as for the secondary range the experimental results can be well described analytically.

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