Towards model-based engineering of underfill materials: CTE modeling

[1]  Herbert Reichl,et al.  Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[2]  M. Flemings,et al.  Thermal expansion behavior of silver matrix composites , 2000 .

[3]  Ching-Ping Wong,et al.  Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging , 1999 .

[4]  C.P. Wong,et al.  Mixed filler combinations for enhanced thermal conductivity of liquid encapsulants for electronic packaging , 1998, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

[5]  H. Mavoori,et al.  Low-thermal-expansion copper composites via negative CTE metallic elements , 1998 .

[6]  Ching-Ping Wong,et al.  Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion , 1998 .

[7]  H. Sturm,et al.  The scanning force microscope as a tool for the detection of local mechanical properties within the interphase of fibre reinforced polymers , 1998 .

[8]  Sergey V Shkarayev,et al.  Potential Failure Sites in a Flip-Chip Package With and Without Underfill , 1997, Application of Fracture Mechanics in Electronic Packaging.

[9]  A. Dasgupta,et al.  Impact of underfill filler particles on reliability of flip chip interconnects , 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

[10]  W. T. Chen,et al.  Materials and mechanics issues in flip-chip organic packaging , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[11]  K. Salama,et al.  Elastic constants and thermal expansion of aluminum-SiC metal-matrix composites , 1996 .

[12]  R. Rothon.  Particulate-filled Polymer Composites , 1995 .