New Solution for Thermal Management of Electronic Using Electro-Hydro-Dynamic (EHD) Pump in Heat Pipe

Using heat pipe solutions for the thermal management of embedded missiles is all the more complex than military electronic systems have to sustain very harsh environments (accelerations, vibrations and temperatures) for long-term applications. However, Electro-Hydro-Dynamic (EHD) pumps have demonstrated promising performances for draining of fluids. Their main advantage is that no mechanical part is involved during operation. Moreover, compatible with MEMS technologies, they could be miniaturized for very dense electronics. The main goal of this paper was to determine influent design parameters for EHD pumps (made with Cu planar footprints on epoxide FR4 substrates). Various fluids were also tested, showing the most efficient solutions compatible with heat transfer applications.