Room Temperature Bonding of Wafers with Thin Nanocrystalline Metal Films and Its Application to Devices Fabrication
暂无分享,去创建一个
[1] D. Buckley,et al. Surface effects in adhesion, friction, wear, and lubrication , 1981 .
[2] Tadatomo Suga,et al. Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method , 1992 .
[3] J. Lodder,et al. Metal bonding during sputter film deposition , 1998 .
[4] W. Maszara,et al. Bonding of silicon wafers for silicon‐on‐insulator , 1988 .