Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration

Photonic wire bonding exploits three-dimensional (3D) two-photon lithography to fabricate single-mode connections between nanophotonic circuits that are located on different chips. The shape of the photonic wire bonds can be adjusted to the positions of the chips such that high-precision alignment becomes obsolete. The technique enables photonic multi-chip modules that combine the strengths of different optical integration platforms.

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