Junction Temperature Measurement Method for Power mosfets Using Turn-On Delay of Impulse Signal

This paper proposes a novel method for junction temperature measurement of power metal-oxide-semiconductor field-effect transistors (mosfets). The measurement method is using the turn-on delay of impulse signal, which is the delay time between the rising edge of impulse signal and the corresponding rising edge of drain–source current. Results show that the turn-on delay has a good linear relationship with temperature, and the method is suitably efficient for accurate junction temperature measurement of power mosfet s. The proposed method is verified using the thermal infrared method. Finally, this method is used to measure the real-time junction temperature of power mosfet device in a dc–dc boost converter.

[1]  B. Jayant Baliga,et al.  Fundamentals of Power Semiconductor Devices , 2008 .

[2]  L. Dupont,et al.  Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters , 2013, IEEE Transactions on Industry Applications.

[3]  E. Woirgard,et al.  Investigation of mechanical stress effect on electrical behavior of Trench Punch Through IGBT under short-circuit condition at low and high temperature , 2011, Proceedings of the 2011 14th European Conference on Power Electronics and Applications.

[4]  Zoubir Khatir,et al.  Investigations on junction temperature estimation based on junction voltage measurements , 2010, Microelectron. Reliab..

[5]  L. Dupont,et al.  Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters—A Review , 2012, IEEE Transactions on Power Electronics.

[6]  Wolfgang Fichtner,et al.  Measurement of the transient junction temperature in MOSFET devices under operating conditions , 2007, Microelectron. Reliab..

[7]  Peter Tavner,et al.  Condition Monitoring for Device Reliability in Power Electronic Converters: A Review , 2010, IEEE Transactions on Power Electronics.

[8]  M. Liserre,et al.  Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities , 2013, IEEE Industrial Electronics Magazine.

[9]  Z. Khatir,et al.  Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions , 2003, Microelectron. J..

[10]  Nick Baker,et al.  IGBT Junction Temperature Measurement via Peak Gate Current , 2016, IEEE Transactions on Power Electronics.

[11]  F. Kolonic,et al.  Important properties of transient thermal impedance for MOS-gated power semiconductors , 1999, ISIE '99. Proceedings of the IEEE International Symposium on Industrial Electronics (Cat. No.99TH8465).

[12]  P. Vales,et al.  Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications , 1998 .

[13]  Dawei Xiang,et al.  An Industry-Based Survey of Reliability in Power Electronic Converters , 2011, IEEE Transactions on Industry Applications.

[14]  Shiwei Feng,et al.  The research on temperature distribution of GaN-based blue laser diode , 2015 .

[15]  Nick Baker,et al.  IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current , 2017, IEEE Transactions on Power Electronics.

[16]  Fred Wang,et al.  Junction temperature measurement of IGBTs using short circuit current , 2012, 2012 IEEE Energy Conversion Congress and Exposition (ECCE).

[17]  Giorgio Vannini,et al.  A new technique for thermal resistance measurement in power electron devices , 2005, IEEE Transactions on Instrumentation and Measurement.

[18]  H. Grubin The physics of semiconductor devices , 1979, IEEE Journal of Quantum Electronics.

[19]  Gerhard Mitic,et al.  Investigation of Temperature Sensitive Electrical Parameters for Power Semiconductors (IGBT) in Real-Time Applications , 2014 .

[20]  R. Herzer,et al.  Method for electrical detection of bond wire lift-off for power semiconductors , 2003, ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings..

[21]  Wolfgang Fichtner,et al.  New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions , 2006, Microelectron. Reliab..

[22]  C Mark Johnson,et al.  Real-Time Compact Thermal Models for Health Management of Power Electronics , 2010, IEEE Transactions on Power Electronics.

[23]  R. Wayne Johnson,et al.  Packaging Technology for Electronic Applications in Harsh High-Temperature Environments , 2011, IEEE Transactions on Industrial Electronics.

[24]  Dawei Xiang,et al.  Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification , 2012, IEEE Transactions on Power Electronics.

[25]  L. Dupont,et al.  Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements , 2012, Microelectron. Reliab..

[26]  Marco Liserre,et al.  Improved Reliability of Power Modules: A Review of Online Junction Temperature Measurement Methods , 2014, IEEE Industrial Electronics Magazine.

[27]  Uwe Scheuermann,et al.  Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the Vce(T)-measurement , 2009, 2009 13th European Conference on Power Electronics and Applications.

[28]  Volker Pickert,et al.  On-line Monitoring of the MOSFET Device Junction Temperature by Computation of the Threshold Voltage , 2006 .

[29]  H. Kuhn,et al.  On-line junction temperature measurement of IGBTs based on temperature sensitive electrical parameters , 2009, 2009 13th European Conference on Power Electronics and Applications.