Interconnect and packaging technology in the '90s

The driving factors for development of Electronic Packaging are the large variety of systems applications and innovations being generated. Leading edge systems developments have accelerated the achievements in ICs. The functional growth of the chips have been tracked by packaging interconnection densities. We highlight the material science contributions and ext. rapolate to the need for new innovations. We discuss the influence of financial environment worldwide and speak to cooperation in precompetitive research at universities.© (1991) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.