Integration of SiP-Based 60-GHz 4 $\,\times\,$4 Antenna Array With CMOS OOK Transmitter and LNA

An integrated system-in-package-based 60-GHz 4 × 4 antenna array with CMOS on-off keying (OOK) transmitter and low-noise amplifier (LNA) is investigated. The 4 × 4 circular polarized array exhibits a wide impedance bandwidth (VSWR <; 2) and 3-dB axial ratio bandwidth of over 8 GHz using a strip line sequential rotation feeding scheme. It has a beam-shaped pattern with a 3-dB beamwidth of 20° and a peak gain of 16.8 dBi. The modulators in 90-nm CMOS includes 60-GHz oscillators and switchable amplifiers to achieve the OOK modulation. The key features of the circuits are small power consumption and size. By applying a bond wire compensation scheme, the LNA and 60-GHz CMOS modulator are successfully integrated into the low-temperature co-fired ceramic package with 2-mil 500-μm-long bond wires. The measurement results for the antenna array with LNA shows a peak gain of ~ 35 dBi. The 60-GHz CMOS modulator is tested at a data rate of 2 Gb/s and the bit-error performance of the system is also demonstrated. The energy usage of 60-GHz modulator at 2 Gb/s is only 13.2 pj/bit for the modulator.

[1]  J. Brinkhoff,et al.  SiP-based 60GHz 4×4 antenna array with 90nm CMOS OOK modulator in LTCC , 2010, 2010 IEEE MTT-S International Microwave Symposium.

[2]  J. Laskar,et al.  60 GHz Linearly And Circularly Polarized Antenna Arrays On Liquid Crystal Polymer Substrate. , 2006, 2006 European Microwave Conference.

[3]  Hong-Yeh Chang,et al.  A 46-GHz Direct Wide Modulation Bandwidth ASK Modulator in 0.13-$\mu$m CMOS Technology , 2007, IEEE Microwave and Wireless Components Letters.

[4]  M. Sun,et al.  On-chip antennas for 60-GHz radios in silicon technology , 2005, IEEE Transactions on Electron Devices.

[5]  B. Floyd,et al.  A silicon 60GHz receiver and transmitter chipset for broadband communications , 2006, 2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers.

[6]  B. Gaucher,et al.  A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications , 2006, IEEE Journal of Solid-State Circuits.

[7]  N. Shino,et al.  Novel circular polarized antenna array substrates for 60GHz-band , 2005, IEEE MTT-S International Microwave Symposium Digest, 2005..

[8]  D. Nesic,et al.  Circular polarised printed antenna array with broadband axial ratio , 2003, IEEE Antennas and Propagation Society International Symposium. Digest. Held in conjunction with: USNC/CNC/URSI North American Radio Sci. Meeting (Cat. No.03CH37450).

[9]  L. L. Wai,et al.  Integration of slot antenna in LTCC package for 60 GHz radios , 2008 .

[10]  Joy Laskar,et al.  A 90nm CMOS 60GHz Radio , 2008, 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.

[11]  K.M. Chua,et al.  Integration of Yagi Antenna in LTCC Package for Differential 60-GHz Radio , 2008, IEEE Transactions on Antennas and Propagation.

[12]  M. Schlechtweg,et al.  51 GHz frontend with flip chip and wire bond interconnections from GaAs MMICs to a planar patch antenna , 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.

[13]  D. Liu,et al.  Design Considerations for Millimeter Wave Antennas within a Chip Package , 2007, 2007 International Workshop on Anti-Counterfeiting, Security and Identification (ASID).

[14]  R. H. Caverly.  Characteristic Impedance of Integrated Circuit Bond Wires (Short Paper) , 1986 .

[15]  A. Lamminen,et al.  60-GHz Patch Antennas and Arrays on LTCC With Embedded-Cavity Substrates , 2008, IEEE Transactions on Antennas and Propagation.

[16]  C. Karnfelt,et al.  High gain active microstrip antenna for 60-GHz WLAN/WPAN applications , 2006, IEEE Transactions on Microwave Theory and Techniques.

[17]  C. Quendo,et al.  A Wideband Circularly Polarized Patch Array for V-band Low-Cost Applications , 2007, 2007 Asia-Pacific Microwave Conference.

[18]  T. Krems,et al.  Millimeter-wave performance of chip interconnections using wire bonding and flip chip , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[19]  B. Gaucher,et al.  A chip-scale packaging technology for 60-GHz wireless chipsets , 2006, IEEE Transactions on Microwave Theory and Techniques.