A 0.13 /spl mu/m DRAM technology for giga bit density stand-alone and embedded DRAMs

In this paper, a 0.13 /spl mu/m DRAM technology is developed with KrF lithography. In order to extend KrF lithography to 0.13 /spl mu/m generation, full CMP technology is developed in order to provide flat surface. Full self-aligned contact (SAC) technology can make memory cell processes easy because memory cell landing pads and storage node contact plug can be formed with self-aligned manner respect to word-line and bit-line. By these technologies, the extremely small memory cell is easily realized without any yield loss. Low-temperature PAOCS MIS capacitor with Al/sub 2/O/sub 3/ can greatly reduce the aspect ratio of metal contact, thereby yielding stable metal contact process. And it can help DRAM technology easily to merge with logic process. The 0.13 /spl mu/m integration technology is successfully demonstrated with 1 Gb DRAM.