Silicon carbide integrated circuits for extreme environments

Analog and digital integrated circuits capable of operating reliably at 300 °C for 2000 hours were designed and fabricated in silicon carbide. These circuits are critical for the development of tools and instrumentation for geothermal exploration. Lateral MOSFETs and resistors were built on Si-face, 4°-off, N+ 4H-SiC substrates. Compact models of these devices were then generated and used to design the circuits, including operational amplifiers, ring oscillators, counters, shift registers and logic gates. The circuits were then fabricated and packaged using specially developed high temperature packaging processes. The integrated circuits were designed to interface with sensors and transducers to produce analog signals that can be digitized and transmitted via a telemetry system capable of sustained operation at 300 °C.

[1]  A. Murphy,et al.  High Temperature Silicon Carbide CMOS Integrated Circuits , 2011 .

[2]  A. Kashyap,et al.  Compact modeling of silicon carbide lateral MOSFETs for extreme environment integrated circuits , 2011, 2011 International Semiconductor Device Research Symposium (ISDRS).

[3]  Carl-Mikael Zetterling,et al.  Bipolar Integrated OR-NOR Gate in 4H-SiC , 2012 .

[4]  Carl-Mikael Zetterling,et al.  500$^{\circ}{\rm C}$ Bipolar Integrated OR/NOR Gate in 4H-SiC , 2013, IEEE Electron Device Letters.

[5]  J. A. Cooper,et al.  Bipolar Integrated Circuits in 4H-SiC , 2011, IEEE Transactions on Electron Devices.

[6]  M. Mehregany,et al.  SiC JFET integrated circuits for sensing and control at temperatures up to 600°C , 2012, 2012 IEEE Energytech.

[7]  H. Ryssel,et al.  4H-SiC N-MOSFET Logic Circuits for High Temperature Operation , 2011 .

[8]  R. Johnson,et al.  Silicon Carbide High Temperature Operational Amplifier , 2012 .

[9]  Liang-Yu Chen,et al.  Stable Electrical Operation of 6H–SiC JFETs and ICs for Thousands of Hours at 500 $^{\circ}\hbox{C}$ , 2008, IEEE Electron Device Letters.

[10]  V. Tilak,et al.  Trap and Inversion Layer Mobility Characterization Using Hall Effect in Silicon Carbide-Based MOSFETs With Gate Oxides Grown by Sodium Enhanced Oxidation , 2009, IEEE Transactions on Electron Devices.

[11]  D. Shaddock,et al.  Assembly Materials and Processes for High-Temperature Geothermal Electronic Modules , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[12]  Glenn Beheim,et al.  Packaging Technologies for High Temperature Electronics and Sensors , 2013 .

[13]  P. Friedrichs,et al.  Silicon carbide power devices - status and upcoming challenges , 2007, 2007 European Conference on Power Electronics and Applications.

[14]  Cheng-Po Chen,et al.  Reliability of SiC Digital Telemetry Circuits on AlN Substrate , 2013 .