Design considerations of HBM stacked DRAM and the memory architecture extension

Recently, the 3D stacked memory, which is known as HBM (high bandwidth memory), using TSV process has been developed. The stacked memory structure provides increased bandwidth, low power consumption, as well as small form factor. There are many design challenges, such as multi-channel operation, microbump test and TSV connection scan. Various design methodology make it possible to overcome the difficulties in the development of TSV technology. Vertical stacking enables more diverse memory architecture than the flat architecture. The next generation of HBM focuses on not only the bandwidth but also the system performance enhancement by adopting pseudo channel and 8-Hi stacking. The architecture applied to the second generation HBM are introduced in this paper.

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