Modeling of the Forming Operation in HfO2-Based Resistive Switching Memories

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[1]  L. Goux,et al.  Evidences of oxygen-mediated resistive-switching mechanism in TiN\HfO2\Pt cells , 2010 .

[2]  Alexander L. Shluger,et al.  The interaction of oxygen vacancies with grain boundaries in monoclinic HfO2 , 2009 .

[3]  H. Wong,et al.  $\hbox{Al}_{2}\hbox{O}_{3}$-Based RRAM Using Atomic Layer Deposition (ALD) With 1-$\mu\hbox{A}$ RESET Current , 2010, IEEE Electron Device Letters.

[4]  Kin Leong Pey,et al.  Nanoscale Characterization of HfO 2 /SiO x Gate Stack Degradation by Scanning Tunneling Microscopy , 2009 .

[5]  L. Larcher,et al.  Modeling temperature dependency (6 – 400K) of the leakage current through the SiO2/high-K stacks , 2010, 2010 Proceedings of the European Solid State Device Research Conference.

[6]  P. Kapur,et al.  Statistical Modeling of Leakage Currents Through SiO2/High-κ Dielectrics Stacks for Non-Volatile Memory Applications , 2008, 2008 IEEE International Reliability Physics Symposium.

[7]  Hiroshi Iwai,et al.  Bilayer gate dielectric study by scanning tunneling microscopy , 2007 .

[8]  Seri Lee,et al.  cONSTRICTION/SPREADING RESISTANCE MODEL FOR ELECTRONICS PACKAGING , 1996 .

[9]  Chien-Hung Yeh,et al.  Unipolar Switching Characteristics for Self-Aligned WOx Resistance RAM (R-RAM) , 2008, 2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).

[10]  M. Porti,et al.  Grain boundary-driven leakage path formation in HfO 2 dielectrics , 2010 .

[11]  Byung Joon Choi,et al.  Resistive switching mechanism of TiO2 thin films grown by atomic-layer deposition , 2005 .

[12]  M. Porti,et al.  Grain boundary-driven leakage path formation in HfO2 dielectrics , 2011, 2010 Proceedings of the European Solid State Device Research Conference.

[13]  Nagarajan Raghavan,et al.  Role of oxygen vacancies in HfO2-based gate stack breakdown , 2010 .

[14]  Byung Joon Choi,et al.  Identification of a determining parameter for resistive switching of TiO2 thin films , 2005 .

[15]  G. Bersuker,et al.  Spectroscopic properties of oxygen vacancies in monoclinic HfO2 calculated with periodic and embedded cluster density functional theory , 2007 .

[16]  Yongjoo Jeon,et al.  Degradation of thin oxides during electrical stress , 2001, Microelectron. Reliab..

[17]  Kin Leong Pey,et al.  Breakdowns in high-k gate stacks of nano-scale CMOS devices , 2005 .

[18]  Luca Larcher,et al.  Statistical simulation of leakage currents in MOS and flash memory devices with a new multiphonon trap-assisted tunneling model , 2003 .

[19]  L. Larcher,et al.  Metal oxide RRAM switching mechanism based on conductive filament microscopic properties , 2010, 2010 International Electron Devices Meeting.

[20]  L. Larcher,et al.  A physics-based model of the dielectric breakdown in HfO2 for statistical reliability prediction , 2011, 2011 International Reliability Physics Symposium.

[21]  J. McPherson,et al.  Thermochemical description of dielectric breakdown in high dielectric constant materials , 2003 .

[22]  Helen Grampeix,et al.  Resistance switching in HfO2 metal-insulator-metal devices , 2010 .

[23]  D. Gillespie A General Method for Numerically Simulating the Stochastic Time Evolution of Coupled Chemical Reactions , 1976 .