Radiometer-on-a-chip: a path toward super-compact submillimeter-wave imaging arrays

A novel approach for submillimeter-wave heterodyne imaging arrays is presented in this paper. By utilizing diverse technologies such as GaAs membrane based terahertz diodes, wafer bonding, bulk Si micromachining, micro-lens optics, and CMOS 3-D chip architectures, a super-compact low-mass submillimeter-wave imaging array is envisioned. A fourwafer based silicon block for a working W-band power amplifier MMIC is demonstrated. This module drastically reduces mass and volume associated with metal block implementations without sacrificing performance. A path towards super compact array receivers in the 500-600 GHz range is described in detail.

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