论文信息 - Thermo-mechanical aspects of reliability for vertically integrated Heterogeneous systems

Thermo-mechanical aspects of reliability for vertically integrated Heterogeneous systems

Vertical device integration is one of the promising device fabrication trends. Heterogeneous device technology research and development faces with new post-fabrication thermo-mechanical problems. Apart from the heat dissipation, temperature dependent mechanical stress spreads across the device affecting its performance. This paper discusses selected stress related device performance and reliability issues.

Grzegorz Janczyk | Piotr Grabiec | Jerzy Szynka | Tomasz. Bieniek

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