论文信息 - Numerical Simulations of Electromigration and Stress-Driven Diffusion in Polycrystalline Interconnects - 字舞流文

Numerical Simulations of Electromigration and Stress-Driven Diffusion in Polycrystalline Interconnects

G. Povirk | G. L. Povirk

[1] Reiner Kirchheim,et al. Stress and electromigration in Al-lines of integrated circuits , 1992 .

[2] Conyers Herring,et al. Diffusional Viscosity of a Polycrystalline Solid , 1950 .

[3] Conyers Herring,et al. Stress generation by electromigration , 1976 .

[4] M. Korhonen,et al. Stress evolution due to electromigration in confined metal lines , 1993 .

[5] L. Freund,et al. Analysis of stress-induced void growth mechanisms in passivated interconnect lines , 1993 .

[6] Honghui Yu,et al. Damage nucleation during electromigration along an isolated interface in an elastic medium , 1996 .