Characterization and model of high quality factor and broadband integrated inductor on Si-substrate
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M.T. Yang | P.P.C. Ho | Y.T. Chia | Y.J. Wang | T.J. Yeh | W.C. Lin | H.M. Hsu | D.D.L. Tang | D. Tang | T. Yeh | Y.J. Wang | Y. Chia | M. Yang | W. Lin | H.M. Hsu | P. Ho
[1] D. Edelstein,et al. Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates , 1996, International Electron Devices Meeting. Technical Digest.
[2] K. Jenkins,et al. Microwave inductors and capacitors in standard multilevel interconnect silicon technology , 1996 .
[3] S. Moinian,et al. High Q inductors for wireless applications in a complementary silicon bipolar process , 1996 .
[4] J.N. Burghartz,et al. Multilevel-spiral inductors using VLSI interconnect technology , 1996, IEEE Electron Device Letters.
[5] On-chip spiral inductors with patterned ground shields for Si-based RF ICs , 1998 .
[6] Tzuen-Hsi Huang,et al. Isolation on Si wafers by MeV proton bombardment for RF integrated circuits , 2001 .