High-temperature lead-free solder alternatives
暂无分享,去创建一个
[1] J. Hattel,et al. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications , 2009 .
[2] Y. Lei,et al. Investigation of rare earth-doped BiAg high-temperature solders , 2010 .
[3] David M. Jacobson,et al. Diffusion soldering for electronics manufacturing , 1994 .
[4] S. C. Kurnaz,et al. Hot tensile and fatigue behaviour of zinc–aluminum alloys produced by gravity and squeeze casting , 2005 .
[5] K. Suganuma,et al. Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers , 2006, Microelectron. Reliab..
[6] K. Suganuma,et al. Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier , 2009 .
[7] Katsuaki Suganuma,et al. Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates , 2009 .
[8] John Hald,et al. Development of gold based solder candidates for flip chip assembly , 2009, Microelectron. Reliab..
[9] J. Hattel,et al. Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system , 2010 .
[10] Jan Vanfleteren,et al. Electro-conductive adhesives for high density package and flip-chip interconnections , 2000 .
[11] Fatang Tan,et al. Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives , 2006 .
[12] M. Abtew,et al. Lead-free Solders in Microelectronics , 2000 .
[13] Y. Yagi,et al. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction , 2006 .
[14] M. Rettenmayr,et al. High Melting Pb‐Free Solder Alloys for Die‐Attach Applications , 2005 .
[15] W. Gale,et al. Transient liquid phase bonding , 2004 .
[16] Johan Liu,et al. Effect of corrosion on the low cycle fatigue behavior of Sn–4.0Ag–0.5Cu lead-free solder joints , 2008 .
[17] Yasushi Yamada,et al. Pb-free high temperature solders for power device packaging , 2006, Microelectron. Reliab..
[18] K. Suganuma,et al. Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application , 2008 .
[19] J. Hattel,et al. Development of Au–Ge based candidate alloys as an alternative to high-lead content solders , 2010 .
[20] Karen Lozano,et al. Study of processing variables on the electrical resistivity of conductive adhesives , 2009 .
[21] J. Hattel,et al. A corrosion investigation of solder candidates for high-temperature applications , 2009 .
[22] Devendra Kumar,et al. Recent advances in isotropic conductive adhesives for electronics packaging applications , 2008 .
[23] K. Ishida,et al. Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use , 1999 .
[24] James E. Morris,et al. Isotropic Conductive Adhesives: Future Trends, Possibilities and Risks , 2005, Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
[25] M. Rettenmayr,et al. Zn-Al based alloys as Pb-free solders for die attach , 2002 .
[26] K. Suganuma,et al. High-temperature lead-free solders: Properties and possibilities , 2009 .
[27] Frank W. Zok,et al. Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system , 2004 .
[28] Nancy F. Dean,et al. Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment , 2002 .