Thermal Management of Vertically Integrated Packages

[1]  K. Banerjee,et al.  Scaling analysis of multilevel interconnect temperatures for high-performance ICs , 2005, IEEE Transactions on Electron Devices.

[2]  B. Michel,et al.  Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[3]  B. Michel,et al.  Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces , 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[4]  M. Gaynes,et al.  A Practical Implementation of Silicon Microchannel Coolers for High Power Chips , 2007, IEEE Transactions on Components and Packaging Technologies.

[5]  M. Rencz.  Thermal issues in stacked die packages , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

[6]  B. Michel,et al.  Hierarchically Nested Channels for Fast Squeezing Interfaces With Reduced Thermal Resistance , 2007, IEEE Transactions on Components and Packaging Technologies.

[7]  Sungjun Im,et al.  Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures , 2005 .

[8]  Patrick E. Phelan,et al.  SIZE EFFECTS ON THE THERMAL CONDUCTIVITY OF POLYMERS LADEN WITH HIGHLY CONDUCTIVE FILLER PARTICLES , 2001, Proceeding of Heat Transfer and Transport Phenomena in Microscale.

[9]  E. Cohen,et al.  Power Distribution Measurements of the Dual Core PowerPC/sup TM/ 970MP Microprocessor , 2006, 2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers.

[10]  B. W. Webb,et al.  Effect of Nozzle Configuration on Transport in the Stagnation Zone of Axisymmetric, Impinging Free-Surface Liquid Jets: Part 2—Local Heat Transfer , 1992 .

[12]  C. Schaeffer,et al.  Thermal Management for Stacked 3D Microelectronic Packages , 2005, 2005 IEEE 36th Power Electronics Specialists Conference.

[13]  H. Reichl,et al.  Forced convective interlayer cooling in vertically integrated packages , 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[14]  R. Reif,et al.  Thermal analysis of three-dimensional (3-D) integrated circuits (ICs) , 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

[15]  A. Jain,et al.  Theoretical investigation of sub-ambient on-chip microprocessor cooling , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[16]  D. Pinjala,et al.  Direct liquid cooling of a stacked multichip module , 2002, 4th Electronics Packaging Technology Conference, 2002..

[17]  Olev Trass,et al.  Mass transfer in a nonuniform impinging jet: Part I. Stagnation flow-velocity and pressure distribution , 1970 .