Thin film decoupling capacitors: a high frequency performance analysis

Parallel and floating plate decoupling capacitors, which exhibit extremely low effective series inductance, have been modeled and their high frequency performance simulated. Simulations compare well with measurement. The effects of various design variations on capacitor performance is reported, as are accurate equivalent circuit models which correctly describe the performance of these devices over a wide frequency range.

[1]  R. Ulrich,et al.  The "Stealth" decoupling capacitor , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[2]  B. Beker,et al.  Analysis of microwave capacitors and IC packages , 1994 .

[3]  A.T. Murphy,et al.  High-frequency design and performance of tubular capacitors , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[4]  Simon S. Ang,et al.  Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[5]  R. C. Frye.  Passive components in electronic applications : Requirements and prospects for integration , 1996 .

[6]  J. Galvagni,et al.  Integrated and integral passive components: a technology roadmap , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[7]  A. T. Murphy,et al.  High frequency performance of multilayer capacitors , 1995 .

[8]  Bidyut K. Sen,et al.  Performance Comparison of Discrete and Buried Capacitors , 1996 .

[9]  J. S. Neely,et al.  Interconnect and circuit modeling techniques for full-chip power supply noise analysis , 1998 .

[10]  Leonard W. Schaper,et al.  High frequency characteristics of MCM decoupling capacitors , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[11]  C. van Dam,et al.  A high frequency model based on the physical structure of the ceramic multilayer capacitor , 1992 .

[12]  H. B. Bakoglu,et al.  Circuits, interconnections, and packaging for VLSI , 1990 .

[13]  Jiayuan Fang,et al.  Modelling and simulation of integral decoupling capacitors in single and multichip module electronics packaging , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.