Cracking of Laminates Subjected to Biaxial Tensile Stresses

During the processing of laminar ceramic, biaxial residual stresses can arise due to differential thermal contraction between unlike layers. A tensile stress can cause preexisting flaws to extend across the layer and into the adjacent layers and then tunnel until they meet either another crack or a free surface. A previous analysis has shown that for a given residual stress there is a critical layer thickness, below which no tunnel cracks will exist, regardless of initial flaw size. Here, the previous analysis was modified to take into account the crack extension into adjacent layers. To determine the validity of the analysis, laminates composed of alternating layers of zirconia and alumina/zirconia were fabricated by a sequential centrifugation technique. The composition of the alumina/zirconia layer was varied to change the biaxial, tensile stresses in the zirconia layer. Observations were then made to determine the critical layer thickness for tunnel cracks and their extension into the adjacent layers. These observations were compared to the theoretical predictions.

[1]  A. Evans,et al.  The cracking and decohesion of thin films on ductile substrates , 1989 .

[2]  A. Heuer,et al.  High-temperature plastic deformation of Y2O3-stabilized ZrO2 single crystals III. Variation in work hardening between 1200 and 1500°C , 1991 .

[3]  J. Srawley Wide range stress intensity factor expressions for ASTM E 399 standard fracture toughness specimens , 1976, International Journal of Fracture.

[4]  Toshimitsu Fujii,et al.  Evaluation of Fracture Toughness for Ceramic Materials by a Single‐Edge‐Precracked‐Beam Method , 1988 .

[5]  R. Moreno,et al.  Alumina and alumina/zirconia multilayer composites obtained by slip casting , 1989 .

[6]  H. Bowen,et al.  Deposition and Sintering of Particle Films on a Rigid Substrate , 1987 .

[7]  E. Macherauch,et al.  Grundlagen und Anwendung der röntgenographischen Spannungsermittlung an Keramiken und Metall‐Keramik‐Verbundwerkstoffen , 1989 .

[8]  D. S. Pearson,et al.  Centrifugal Consolidation of Al2O3 and AI2O3/ZrO2 Composite Slurries vs Interparticle Potentials: Particle Packing and Mass Segregation , 1991 .

[9]  J. C. Conway,et al.  Effect of Joint Thickness and Residual Stresses on the Properties of Ceramic Adhesive Joints: I, Finite Element Analysis of Stresses in Joints , 1987 .

[10]  D. S. Pearson,et al.  Viscosity and Yield Stress of Alumina Slurries Containing Large Concentrations of Electrolyte , 1994 .

[11]  David B. Marshall,et al.  Enhanced Fracture Toughness in Layered Microcomposites of Ce‐ZrO2 and Al2O3 , 1991 .

[12]  T. Nieh,et al.  Superelastic behaviour of a fine-grained, yttria-stabilized, tetragonal zirconia polycrystal (Y-TZP) , 1990 .

[13]  A. Heuer,et al.  Microstructural Characterization of Cofired Tungsten‐Metallized High‐Alumina Electronic Substrates , 1992 .

[14]  Z. Suo,et al.  Tunneling Cracks in Constrained Layers , 1993 .

[15]  Z. Suo,et al.  Thin film cracking and the roles of substrate and interface , 1992 .

[16]  F. Lange Transformation toughening , 1982 .

[17]  A. Levy,et al.  Thermal Residual Stresses in Ceramic‐to‐Metal Brazed Joints , 1991 .

[18]  T. Watkins,et al.  Fracture Behavior of CVD SiC‐Coated Graphite: II, Conditions for the Onset of Multiple Cracking , 1994 .

[19]  D. S. Pearson,et al.  Pressure Sensitivity for Particle Packing of Aqueous Al2O3 Slurries vs Interparticle Potential , 1994 .

[20]  D. K. Swanson,et al.  High‐Performance Multilayer Capacitor Dielectrics from Chemically Prepared Powders , 1993 .

[21]  D. S. Pearson,et al.  New method for efficient colloidal particle packing via modulation of repulsive lubricating hydration forces , 1990 .

[22]  P. Sarkar,et al.  Structural Ceramic Microlaminates by Electrophoretic Deposition , 1992 .

[23]  M. Harmer,et al.  Design of a Laminated Ceramic Composite for Improved Strength and Toughness , 1992 .