The use of metal-matrix Al-SiC composites in heat-spreading bases of power electronic devices
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V. Yudin | V. Eliseev | M. I. Novopoltsev | K. Nishchev | L. A. Emikh | N. Fomin | A. N. Afanas’ev-Khodykin
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V. Yudin | V. Eliseev | M. I. Novopoltsev | K. Nishchev | L. A. Emikh | N. Fomin | A. N. Afanas’ev-Khodykin