A novel method for evaluating triaxial strain gages used in printed circuit board assemblies (PCBA) strain monitoring

This paper reports a novel method for evaluating strain gages. In this method, the evaluated gage is attached at a specific location of coupon board, and then deflects 5 known distances by steps by the insertion of shims with different thicknesses. The strain for each bended status is recorded and can be compared against expected variation. If the principle strain values and corresponding angles within the tolerance, the gage passes the test and can be applied in practical strain measurement with increased confidence, otherwise it will be deprived of the qualification to accept. Moreover, this method combines with accredited gages can also be used to find and eliminate many errors due to gage placement, gage attachment, measurement equipment setup, and lead wires. In order to prove the validity of the given method, three types of gages from various suppliers at are evaluated, and the results of test broadly consistent with technical backgrounds of their respective manufacturers.

[1]  Yasuhisa Yamaji,et al.  New evaluation method of CSPs board level reliability using strain gauge , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[2]  E. Bradley,et al.  A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[3]  Yilin Yan,et al.  Research on Micro Crack Induced during the Process of Assembling BGA , 2006, 2006 7th International Conference on Electronic Packaging Technology.

[4]  Y. Danto,et al.  Solder Joint Loading Conditions under Torsion Test , 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[5]  Yuming Ye,et al.  Experimental Testing and Failure Prediction of PBGA Package Assemblies under 3-Point Bending Condition through Computational Stress Analysis , 2006, 2006 7th International Conference on Electronic Packaging Technology.

[6]  A. Dasgupta,et al.  An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies , 2007, Microelectron. Reliab..

[7]  Yeo Hoon Yoon,et al.  Torsional fatigue life prediction method for DRAM module , 2007, 2007 International Conference on Electronic Materials and Packaging.

[8]  Dongkai Shangguan,et al.  Impact Performance of Microvia and Buildup Layer Materials and Its Contribution to Drop Test Failures , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

[9]  M. Brown,et al.  Reliability of wafer level chip scale packages (WL-CSP) under dynamic loadings , 2008, 2008 58th Electronic Components and Technology Conference.

[10]  K. Newman.  Board-level solder joint reliability of high performance computers under mechanical loading , 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

[11]  Jeffery C. C. Lo,et al.  Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability , 2009, 2009 59th Electronic Components and Technology Conference.

[12]  Chaoran Yang,et al.  Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis , 2009, 2009 11th Electronics Packaging Technology Conference.

[13]  Natalja Schafet,et al.  Development of a submodel technique for the simulation of solder joint fatigue of electronic devices mounted within an assembled ECU. , 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[14]  Chaoran Yang,et al.  Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

[15]  M. Y. Tsai,et al.  Warpage and curvature determination of PCB with DIMM socket during reflow process by strain gage measurement , 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

[16]  Elizabeth Benedetto,et al.  Characterizing mechanical performance of Board Level Interconnects for In-Circuit Test , 2010, 2010 IEEE International Test Conference.