Experimental investigation of a PCM-HP heat sink on its thermal performance and anti-thermal-shock capacity for high-power LEDs

[1]  Chun Zhang,et al.  Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package , 2015 .

[2]  Halime Paksoy,et al.  Improving thermal conductivity phase change materials—A study of paraffin nanomagnetite composites , 2015 .

[3]  Jing Wang,et al.  Thermal model design and analysis of the high-power LED automotive headlight cooling device , 2015 .

[4]  Tzer-Ming Jeng,et al.  Combined convection and radiation heat transfer of the radially finned heat sink with a built-in motor fan and multiple vertical passages , 2015 .

[5]  T. Jeng,et al.  Heat transfer measurement of the cylindrical heat sink with sintered-metal-bead-layers fins and a built-in motor fan☆ , 2014 .

[6]  Sung-Uk Zhang,et al.  Fatigue life evaluation of wire bonds in LED packages using numerical analysis , 2014, Microelectron. Reliab..

[7]  Paolo Principi,et al.  A comparative life cycle assessment of luminaires for general lighting for the office – compact fluorescent (CFL) vs Light Emitting Diode (LED) – a case study , 2014 .

[8]  G. Tan,et al.  A review of thermoelectric cooling: Materials, modeling and applications , 2014 .

[9]  Bin Liu,et al.  A high power LED device with chips directly mounted on heat pipes , 2014 .

[10]  Xin Fang,et al.  Thermal energy storage performance of paraffin-based composite phase change materials filled with hexagonal boron nitride nanosheets , 2014 .

[11]  Kwan-Soo Lee,et al.  Optimum design of a radial heat sink with a fin-height profile for high-power LED lighting applications , 2014 .

[12]  Shou-Shing Hsieh,et al.  A microspray-based cooling system for high powered LEDs , 2014 .

[13]  Seunghwan Yoo,et al.  Effect of LED lighting on the cooling and heating loads in office buildings , 2014 .

[14]  Raya Al-Dadah,et al.  Experimental investigation of inserts configurations and PCM type on the thermal performance of PCM based heat sinks , 2013 .

[15]  G. P. Peterson,et al.  Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays , 2013 .

[16]  Daming Wang,et al.  A loop-heat-pipe heat sink with parallel condensers for high-power integrated LED chips , 2013 .

[17]  Chakravarthy Balaji,et al.  Thermal optimization of PCM based pin fin heat sinks: An experimental study , 2013 .

[18]  Jussi Hokka,et al.  Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters , 2013, Journal of Electronic Materials.

[19]  Bongtae Han,et al.  Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability , 2013, Microelectron. Reliab..

[20]  Jussi Hokka,et al.  Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms , 2013, Journal of Electronic Materials.

[21]  Luisa F. Cabeza,et al.  Review on phase change materials (PCMs) for cold thermal energy storage applications , 2012 .

[22]  Qin Zhang,et al.  Fluid-solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing , 2012, Microelectron. Reliab..

[23]  Kai Wang,et al.  Study on the Reliability of Application-Specific LED Package by Thermal Shock Testing, Failure Analysis, and Fluid–Solid Coupling Thermo-Mechanical Simulation , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[24]  Hsueh-Han Wu,et al.  A study on the heat dissipation of high power multi-chip COB LEDs , 2012, Microelectron. J..

[25]  Yan-Ping Wang,et al.  Thermal analysis of high power LED package with heat pipe heat sink , 2011, Microelectron. J..

[26]  Zirong Lin,et al.  Heat transfer characteristics and LED heat sink application of aluminum plate oscillating heat pipes , 2011 .

[27]  Xiaobing Luo,et al.  Comparison of LED package reliability under thermal cycling and thermal shock conditions by experimental testing and finite element simulation , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

[28]  Chih-Chung Chang,et al.  Heat pipe with PCM for electronic cooling , 2011 .

[29]  Dan Zhou,et al.  Experimental investigations on heat transfer in phase change materials (PCMs) embedded in porous materials , 2011 .

[30]  W. Lu,et al.  Heat transfer enhancement for thermal energy storage using metal foams embedded within phase change materials (PCMs) , 2010 .

[31]  F. Tan,et al.  Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks , 2010 .

[32]  A. Sharma,et al.  Review on thermal energy storage with phase change materials and applications , 2009 .

[33]  Pradip Dutta,et al.  Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials , 2008 .

[34]  Jean Paul Freyssinier,et al.  Solid-state lighting: failure analysis of white LEDs , 2004 .

[35]  E. Fred Schubert,et al.  Light Emitting Diodes , 1987 .

[36]  Stephen J. Kline,et al.  The Purposes of Uncertainty Analysis , 1985 .