Experimental investigation of a PCM-HP heat sink on its thermal performance and anti-thermal-shock capacity for high-power LEDs
暂无分享,去创建一个
Wei Yuan | Zongtao Li | Yong Tang | Binhai Yu | Xuezhi Zhao | Xinrui Ding | Xuezhi Zhao | Yong Tang | W. Yuan | Zongtao Li | Xinrui Ding | Binhai Yu | Wu Yuxuan | Wu Yuxuan
[1] Chun Zhang,et al. Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package , 2015 .
[2] Halime Paksoy,et al. Improving thermal conductivity phase change materials—A study of paraffin nanomagnetite composites , 2015 .
[3] Jing Wang,et al. Thermal model design and analysis of the high-power LED automotive headlight cooling device , 2015 .
[4] Tzer-Ming Jeng,et al. Combined convection and radiation heat transfer of the radially finned heat sink with a built-in motor fan and multiple vertical passages , 2015 .
[5] T. Jeng,et al. Heat transfer measurement of the cylindrical heat sink with sintered-metal-bead-layers fins and a built-in motor fan☆ , 2014 .
[6] Sung-Uk Zhang,et al. Fatigue life evaluation of wire bonds in LED packages using numerical analysis , 2014, Microelectron. Reliab..
[7] Paolo Principi,et al. A comparative life cycle assessment of luminaires for general lighting for the office – compact fluorescent (CFL) vs Light Emitting Diode (LED) – a case study , 2014 .
[8] G. Tan,et al. A review of thermoelectric cooling: Materials, modeling and applications , 2014 .
[9] Bin Liu,et al. A high power LED device with chips directly mounted on heat pipes , 2014 .
[10] Xin Fang,et al. Thermal energy storage performance of paraffin-based composite phase change materials filled with hexagonal boron nitride nanosheets , 2014 .
[11] Kwan-Soo Lee,et al. Optimum design of a radial heat sink with a fin-height profile for high-power LED lighting applications , 2014 .
[12] Shou-Shing Hsieh,et al. A microspray-based cooling system for high powered LEDs , 2014 .
[13] Seunghwan Yoo,et al. Effect of LED lighting on the cooling and heating loads in office buildings , 2014 .
[14] Raya Al-Dadah,et al. Experimental investigation of inserts configurations and PCM type on the thermal performance of PCM based heat sinks , 2013 .
[15] G. P. Peterson,et al. Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays , 2013 .
[16] Daming Wang,et al. A loop-heat-pipe heat sink with parallel condensers for high-power integrated LED chips , 2013 .
[17] Chakravarthy Balaji,et al. Thermal optimization of PCM based pin fin heat sinks: An experimental study , 2013 .
[18] Jussi Hokka,et al. Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters , 2013, Journal of Electronic Materials.
[19] Bongtae Han,et al. Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability , 2013, Microelectron. Reliab..
[20] Jussi Hokka,et al. Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms , 2013, Journal of Electronic Materials.
[21] Luisa F. Cabeza,et al. Review on phase change materials (PCMs) for cold thermal energy storage applications , 2012 .
[22] Qin Zhang,et al. Fluid-solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing , 2012, Microelectron. Reliab..
[23] Kai Wang,et al. Study on the Reliability of Application-Specific LED Package by Thermal Shock Testing, Failure Analysis, and Fluid–Solid Coupling Thermo-Mechanical Simulation , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[24] Hsueh-Han Wu,et al. A study on the heat dissipation of high power multi-chip COB LEDs , 2012, Microelectron. J..
[25] Yan-Ping Wang,et al. Thermal analysis of high power LED package with heat pipe heat sink , 2011, Microelectron. J..
[26] Zirong Lin,et al. Heat transfer characteristics and LED heat sink application of aluminum plate oscillating heat pipes , 2011 .
[27] Xiaobing Luo,et al. Comparison of LED package reliability under thermal cycling and thermal shock conditions by experimental testing and finite element simulation , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
[28] Chih-Chung Chang,et al. Heat pipe with PCM for electronic cooling , 2011 .
[29] Dan Zhou,et al. Experimental investigations on heat transfer in phase change materials (PCMs) embedded in porous materials , 2011 .
[30] W. Lu,et al. Heat transfer enhancement for thermal energy storage using metal foams embedded within phase change materials (PCMs) , 2010 .
[31] F. Tan,et al. Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks , 2010 .
[32] A. Sharma,et al. Review on thermal energy storage with phase change materials and applications , 2009 .
[33] Pradip Dutta,et al. Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials , 2008 .
[34] Jean Paul Freyssinier,et al. Solid-state lighting: failure analysis of white LEDs , 2004 .
[35] E. Fred Schubert,et al. Light Emitting Diodes , 1987 .
[36] Stephen J. Kline,et al. The Purposes of Uncertainty Analysis , 1985 .