Role of Material Properties in the Thermal‐Stress Fracture of Brittle Ceramics Subjected to Conductive Heat Transfer

An analysis is presented of the thermal stresses in brittle ceramics subjected to thermal shock by quenching into a liquid medium in which conduction is the primary mechanism of heat transfer. The magnitude of maximum stress was shown to be a function of the coefficient of thermal expansion, Young's modulus, and Poisson's ratio of the ceramic, as well as the values of the thermal conductivity, specific heat, and density of the ceramic and quenching medium. The magnitude of thermal stress was shown to be independent of specimen size and, on cooling, to occur at the instant of cooling (t=0). Appropriate thermal-stress resistance parameters were derived.

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