Paralleling of High Power Dual Modules: Standard Building Block Design for Evaluation of Module Related Current Mismatch

3 Abstract This paper discusses the challenges of paralleling dual modules with special focus on the currently introduced half bridge modules with 100 mm * 140 mm footprint like LinPak, ${}_{\mathrm{n}}\mathrm{HPD}^{2}$, XHP2/3, LV/HV100, etc. Compared to conventional high power converters build up using single switches (e.g. 190 mm * 140 mm footprint) a higher number of paralleled dual modules (by a factor of 3 to 4) is required to achieve equivalent output power, needed e.g. for traction applications. This paper picks up known design features [1], required to avoid design related current imbalance and suggests a reference setup for the paralleling of high power dual modules to focus on current imbalances that are generated by semiconductor device characteristics. This reference setup is based on the uniform basic design idea by the device manufacturers, to put the parallel modules in a row and to design the converter, corresponding to the semiconductor module, as a strip line [2]. Remaining design options are discussed with regard to gate control to conclude with a standardized reference design.