FDSOI SRAM cells for low power design at 22nm technology node

The silicon-on-insulator (SOI) MOSFET is considered as an alternative to the bulk (silicon-based MOSFET in CMOS circuits for applications requiring low-voltage and low-power operation. Fully depleted SOI (FDSOI) benefits from a high current driven ability; so, this technology preserves advantageous features, such as steep sub threshold characteristics and small short channel effects. This paper presents a comprehensive assessment of different SRAM (Static Random Access Memory) cells utilizing different numbers of transistors (i.e. 8 and 9). These cells are evaluated by HSPICE for different performance metrics (such as write/read delay, stability, critical charge, power consumption and tolerance to voltage threshold variation) at the 22nm technology node.