Laser ablation of dielectrics with pulse durations between 20 fs and 3 ps

Laser‐induced ablation has been extended down to a pulse duration of 20 fs generated by a Ti sapphire laser system at a wavelength of 780 nm. Barium aluminum borosilicate glass with an extremely high glass transformation temperature (∼600 °C) served as target material. The most significant observation was a substantial decrease of the ablation threshold fluence at pulse durations below 100 fs. All results indicate a dominant role of multiphoton absorption in addition to collisional ionization in this time domain.