论文信息 - Study of the Thermal Stability of Copper Contact Junctions in Si/SiO2 Substrates - 字舞流文

Study of the Thermal Stability of Copper Contact Junctions in Si/SiO2 Substrates

V. Labunov | E. Utkina | A. Khodin | O. Sycheva | T. I. Ezovitova | A. I. Vorobĩeva