Flip-Chip III-V-to-Silicon Photonics Interfaces for Optical Sensor

We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.

[1]  Tymon Barwicz,et al.  Automated, high-throughput photonic packaging , 2018 .

[2]  Tymon Barwicz,et al.  Demonstration of self-aligned flip-chip photonic assembly with 1.1dB loss and > 120nm bandwidth , 2016 .

[3]  S. Pinna,et al.  3D integrated hybrid silicon laser , 2015, 2015 European Conference on Optical Communication (ECOC).

[4]  Sarvagya Dwivedi,et al.  High-Thermal Performance 3D Hybrid Silicon Lasers , 2017, IEEE Photonics Technology Letters.

[5]  P. Buchmann,et al.  A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology , 1994 .

[6]  Alan Y. Liu,et al.  Heterogeneous Silicon Photonic Integrated Circuits , 2016, Journal of Lightwave Technology.

[7]  Tymon Barwicz,et al.  Methane Absorption Spectroscopy with a Hybrid III-V Silicon External Cavity Laser , 2018, 2018 Conference on Lasers and Electro-Optics (CLEO).

[8]  Shinsuke Tanaka,et al.  High-output-power, single-wavelength silicon hybrid laser using precise flip-chip bonding technology. , 2012, Optics express.

[9]  Tomoyuki Akiyama,et al.  Four-wavelength silicon hybrid laser array with ring-resonator based mirror for efficient CWDM transmitter , 2013, 2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC).

[10]  Tymon Barwicz,et al.  Silicon photonic integrated circuit for on-chip spectroscopic gas sensing , 2019, OPTO.

[11]  Xuezhe Zheng,et al.  High power and widely tunable Si hybrid external-cavity laser for power efficient Si photonics WDM links. , 2014, Optics express.

[12]  Tymon Barwicz,et al.  Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension , 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

[13]  John E. Cunningham,et al.  Power-efficient III-V/silicon external cavity DBR lasers. , 2012, Optics express.

[14]  Daniel Y. Lee,et al.  III–V/Si Vernier-Ring Comb Lasers (VRCLs) , 2017, IEEE Journal of Selected Topics in Quantum Electronics.

[15]  T. Barwicz,et al.  Novel Solder Pads for Self-Aligned Flip-Chip Assembly , 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

[16]  Aleksandar Nesic,et al.  Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding , 2018, Optica.

[17]  John E. Bowers,et al.  A comparison of four approaches to photonic integration , 2017, 2017 Optical Fiber Communications Conference and Exhibition (OFC).