论文信息 - Stress Rate and Proof‐Testing of Silicon Wafers

Stress Rate and Proof‐Testing of Silicon Wafers

Fracture mechanics test methods were applied to evaluate the proof-test characteristics of single-crystal silicon wafers. The results indicate that the strength distribution of silicon wafers is truncated by proof-testing. No subcritical crack growth occurred during proof-loading, as inferred from the lack of a stress-rate effect on strength. Mechanical proof-testing appears to be an effective method for eliminating weak samples before cell processing.

C. P. Chen | M. H. Leipold

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