Differential Wide Temperature Range CMOS Interface Circuit for Capacitive MEMS Pressure Sensors

We describe a Complementary Metal-Oxide Semiconductor (CMOS) differential interface circuit for capacitive Micro-Electro-Mechanical Systems (MEMS) pressure sensors that is functional over a wide temperature range between −55 °C and 225 °C. The circuit is implemented using IBM 0.13 μm CMOS technology with 2.5 V power supply. A constant-gm biasing technique is used to mitigate performance degradation at high temperatures. The circuit offers the flexibility to interface with MEMS sensors with a wide range of the steady-state capacitance values from 0.5 pF to 10 pF. Simulation results show that the circuitry has excellent linearity and stability over the wide temperature range. Experimental results confirm that the temperature effects on the circuitry are small, with an overall linearity error around 2%.

[1]  H. S. Wolff,et al.  iRun: Horizontal and Vertical Shape of a Region-Based Graph Compression , 2022, Sensors.

[2]  Chuan Yi Tang,et al.  A 2.|E|-Bit Distributed Algorithm for the Directed Euler Trail Problem , 1993, Inf. Process. Lett..

[3]  F. Trofimenkoff,et al.  High temperature electronics using silicon technology , 1996, 1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC.

[4]  James H. Smith,et al.  Micromachined pressure sensors: review and recent developments , 1997 .

[5]  P. de Jong,et al.  A 300/spl deg/C dynamic-feedback instrumentation amplifier , 1998, 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, ISSCC. First Edition (Cat. No.98CH36156).

[6]  A.H.M. van Roermund,et al.  A 300°C Dynamic-Feedback Instrumentation Amplifier , 1998 .

[7]  Gerard C. M. Meijer,et al.  A high-temperature electronic system for pressure-transducers , 2000, IEEE Trans. Instrum. Meas..

[8]  Todd E. Mlsna,et al.  Chemicapacitive microsensors for volatile organic compound detection , 2003 .

[9]  Gary W. Hunter,et al.  An Overview of High-Temperature Electronics and Sensor Development at NASA Glenn Research Center , 2003 .

[10]  S. Beeby,et al.  MEMS Mechanical Sensors , 2004 .

[11]  F.A. Levinzon 175$^circhboxC$Silicon-Based Hybrid Charge Amplifier for 175$^circhboxC$and 100-mV/G Miniature Piezoelectric Accelerometer , 2006, IEEE Sensors Journal.

[12]  Kensall D. Wise,et al.  Integrated sensors, MEMS, and microsystems: Reflections on a fantastic voyage , 2007 .

[13]  Y. Hezarjaribi,et al.  Capacitive pressure sensors based on MEMS, operating in harsh environments , 2008, 2008 IEEE International Conference on Semiconductor Electronics.

[14]  Shahriar Mirabbasi,et al.  A 2.5 V 0.13 μm CMOS amplifier for a high-temperature sensor system , 2009, 2009 Joint IEEE North-East Workshop on Circuits and Systems and TAISA Conference.

[15]  Beth L. Pruitt,et al.  Review: Semiconductor Piezoresistance for Microsystems , 2009, Proceedings of the IEEE.

[16]  Dominique Dallet,et al.  Modeling Methodology for Analog Front-End Circuits Dedicated to High-Temperature Instrumentation and Measurement Applications , 2011, IEEE Transactions on Instrumentation and Measurement.

[17]  Masayoshi Esashi Revolution of Sensors in Micro-Electromechanical Systems , 2012 .

[18]  Steve Majerus,et al.  Design and long-term operation of high-temperature, bulk-CMOS integrated circuits for instrumentation and control , 2013, 2013 IEEE Energytech.

[19]  Minkyu Je,et al.  Sample-and-hold circuit with dynamic switch leakage compensation , 2013 .

[20]  George Xereas,et al.  Design and fabrication of three-axis accelerometer sensor microsystem for wide temperature range applications using semi-custom process , 2014, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.