Microstructured In-Plane Thermoelectric Generators with Optimized Heat Path

This paper proposes a multipurpose platform with standard thin-film CMOS fabrication technology for thermocouples for many materials and a high integration density. The heat flow path is perpendicular to the chip surface (cross-plane) and guided by special thermal connectors. On the thermocouples, a grid structure with thermally insulating SU-8 and electrodeposited metal stripes connects one junction of the thermocouple with the environment. The substrate is structured with trenches to connect the other junction with the environment. About 95% of the total temperature difference is between the two thermocouple junctions. Test chips with up to 13 460 thermocouples (Al - n-poly-Si) produce an output power of up to 3.17.10-3muW/mm2K2 per chip.

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