Analytical challenges in next generation packaging/assembly

Next generation assembly/package development challenges are primarily thermal mechanical as interconnect levels increase and product performance drives the need for increased speed and power dissipation. The results of this trend present some distinct challenges for the analytical tool/technique set necessary to support this technical roadmap. The challenges in assembly analytical tool/technique development are in the areas of nondestructive imaging, board level fault isolation and materials property measurement to model and validate the thermal mechanical response of the assemblage. The purpose of this paper is to review the likely defects in next generation packages and the analytical approaches to identify these defects.