Study and mechanical characterization of high temperature power electronic packaging

The increase of electric power demand for embedded systems requires more efficient power electronics modules (power converters, rectifiers ...). A solution to reach this goal relates to the use of high gap electronic chips as diamond-based components that allow high voltage and current density. The induced module design obviously sorely increases the maximum thermal and thermomechanical stresses in the packaged modules. In this work, we carry out experimental and numerical investigations of two types of high temperature silver connections elaborated at low temperatures by means diffusion heat treatment and by sintering. Mechanical behaviour of the junction is characterized by shear tests. At last, numerical simulations are used to simulate process and services thermal cycles and to assess stresses level at several stages of the assembly service life. All testing and simulation works allow validating the accuracy of the two kinds of connections and demonstrating their interest.