Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling

[1]  Adrian Bejan,et al.  Constructal tree network for fluid flow between a finite-size volume and one source or sink , 1997 .

[2]  R. Pease,et al.  High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[3]  G. Yoon Topological design of heat dissipating structure with forced convective heat transfer , 2010 .

[4]  B. Paul,et al.  Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers , 2011 .

[5]  Jérôme Barrau,et al.  An experimental study of a new hybrid jet impingement/micro-channel cooling scheme , 2010 .

[6]  M. Bendsøe,et al.  Topology Optimization: "Theory, Methods, And Applications" , 2011 .

[7]  J. Zemel,et al.  Analysis of microchannels for integrated cooling , 1992 .

[8]  Deborah V. Pence,et al.  The simplicity of fractal-like flow networks for effective heat and mass transport , 2010 .

[9]  Arun S. Mujumdar,et al.  Flow and thermal characteristics of offset branching network , 2010 .

[10]  K. Vafai,et al.  Analysis of two-layered micro-channel heat sink concept in electronic cooling , 1999 .

[11]  Yogendra Joshi,et al.  Optimization study of stacked micro-channel heat sinks for micro-electronic cooling , 2003 .

[12]  Benoit B. Mandelbrot,et al.  Fractal Geometry of Nature , 1984 .

[13]  R. Vaidyanathan,et al.  Multi-layered SiC microchannel heat sinks - modeling and experiment , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[14]  Jin Taek Kim,et al.  Forced air cooling by using manifold microchannel heat sinks , 1998 .

[15]  P. Cheng,et al.  Heat transfer and pressure drop in fractal tree-like microchannel nets , 2002 .

[16]  Ole Sigmund,et al.  A 99 line topology optimization code written in Matlab , 2001 .

[17]  S. Garimella,et al.  Single-Phase Flow and Heat Transport and Pumping Considerations in Microchannel Heat Sinks , 2004 .

[18]  J. Petersson,et al.  Topology optimization of fluids in Stokes flow , 2003 .

[19]  I. Mudawar Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations , 2011 .

[20]  K. Svanberg The method of moving asymptotes—a new method for structural optimization , 1987 .

[21]  Frank P. Incropera,et al.  Liquid Cooling of Electronic Devices by Single-Phase Convection , 1999 .

[22]  J. Calame,et al.  Investigation of Hierarchically Branched-Microchannel Coolers Fabricated by Deep Reactive Ion Etching for Electronics Cooling Applications , 2009 .

[23]  Adrian Bejan,et al.  Tree-shaped vascular wall designs for localized intense cooling , 2009 .

[24]  L. H. Olesen,et al.  A high‐level programming‐language implementation of topology optimization applied to steady‐state Navier–Stokes flow , 2004, physics/0410086.

[25]  Ercan M. Dede,et al.  Multiphysics optimization, synthesis, and application of jet impingement target surfaces , 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[26]  G. M. Harpole,et al.  Micro-channel heat exchanger optimization , 1991, 1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium.

[27]  Yan Liu,et al.  Computational methods for the optimisation and design of electromechanical vehicle systems , 2012 .

[28]  Sushil H. Bhavnani,et al.  Thermal Challenges in Next-Generation Electronic Systems , 2008 .

[29]  J. Reddy,et al.  The Finite Element Method in Heat Transfer and Fluid Dynamics , 1994 .

[30]  Yan Liu,et al.  Scale Effects on Thermal-Fluid Performance of Optimized Hierarchical Structures , 2011 .

[31]  D. Pence,et al.  REDUCED PUMPING POWER AND WALL TEMPERATURE IN MICROCHANNEL HEAT SINKS WITH FRACTAL-LIKE BRANCHING CHANNEL NETWORKS , 2003 .

[32]  Y. Joshi,et al.  Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components , 2000, Heat Transfer: Volume 4.

[33]  S. Nishiwaki,et al.  Topology optimization for thermal conductors considering design-dependent effects, including heat conduction and convection , 2009 .