Hierarchical three-dimensional layer-by-layer assembly of carbon nanotube wafers for integrated nanoelectronic devices.
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K. Hata | H. Akinaga | Takeo Yamada | Y. Hayamizu | Yuki Yamamoto | Y. Yomogida | D. Futaba | K. Kobashi | H. Shima | A. Sekiguchi | Hiroyuki Tanaka | Natsumi Makiomoto