Wafer-to-wafer bonding for microstructure formation

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods are discussed. Opportunities for continued development are outlined.

[1]  G. Wallis,et al.  Field Assisted Glass‐Metal Sealing , 1969 .

[2]  G. Wallis,et al.  Direct‐Current Polarization During Field‐Assisted Glass‐Metal Sealing , 1970 .

[3]  A. D. Brooks,et al.  Low‐Temperature Electrostatic Silicon‐to‐Silicon Seals Using Sputtered Borosilicate Glass , 1972 .

[4]  T. R. Anthony.  Anodic bonding of imperfect surfaces , 1983 .

[5]  T. R. Anthony.  Dielectric isolation of silicon by anodic bonding , 1985 .

[6]  R. C. Frye,et al.  A Field‐Assisted Bonding Process for Silicon Dielectric Isolation , 1986 .

[7]  P. Barth,et al.  A monolithic silicon accelerometer with integral air damping and overrange protection , 1988, IEEE Technical Digest on Solid-State Sensor and Actuator Workshop.

[8]  W. Maszara,et al.  Bonding of silicon wafers for silicon‐on‐insulator , 1988 .

[9]  K. Wise,et al.  An ultraminiature solid-state pressure sensor for a cardiovascular catheter , 1988 .

[10]  J. R. Mallon,et al.  Silicon fusion bonding for pressure sensors , 1988, IEEE Technical Digest on Solid-State Sensor and Actuator Workshop.

[11]  U. Gosele,et al.  Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment , 1988 .

[12]  J. Haisma,et al.  Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technological Evaluations , 1989 .

[13]  Takao Abe,et al.  Silicon Wafer-Bonding Process Technology for SOI Structures , 1990 .

[14]  Yozo Kanda,et al.  The mechanism of field-assisted silicon-glass Bonding , 1990 .

[15]  K. Petersen,et al.  Surface micromachined structures fabricated with silicon fusion bonding , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.

[16]  W. Maszara,et al.  Role of surface morphology in wafer bonding , 1991 .

[17]  K. Albaugh,et al.  Electrode Phenomena during Anodic Bonding of Silicon to Sodium Borosilicate Glass , 1991 .

[18]  Henry Guckel,et al.  Surface micromachined pressure transducers , 1991 .

[19]  Zhijian Li,et al.  A novel structure of pressure sensors , 1991 .

[20]  A. Hanneborg.  Silicon wafer bonding techniques for assembly of micromechanical elements , 1991, [1991] Proceedings. IEEE Micro Electro Mechanical Systems.

[21]  W. Maszara.  Silicon‐On‐Insulator by Wafer Bonding: A Review , 1991 .

[22]  B. Muller,et al.  Tensile strength characterization of low-temperature fusion-bonded silicon wafers , 1991 .

[23]  Low Temperature, High Strength, Wafer‐to‐Wafer Bonding , 1992 .

[24]  Stefan Bengstsson.  Semiconductor wafer bonding: a review of interfacial properties and applications , 1992 .

[25]  M. A. Huff,et al.  Fabrication, packaging, and testing of a wafer-bonded microvalve , 1992, Technical Digest IEEE Solid-State Sensor and Actuator Workshop.

[26]  B. Roberds,et al.  Low temperature Si3N4 direct bonding , 1993 .

[27]  Thermal isolation of high-temperature superconducting thin films using silicon wafer bonding and micromachining , 1993 .

[28]  Werner Langheinrich,et al.  Application of oxygen plasma processing to silicon direct bonding , 1993 .

[29]  M. Schmidt,et al.  Design of sealed cavity microstructures formed by silicon wafer bonding , 1993 .

[30]  G. Kissinger,et al.  Void-free silicon-wafer-bond strengthening in the 200–400 °C range , 1993 .

[31]  U. Gösele,et al.  Low temperature wafer direct bonding , 1994 .

[32]  Ljubiša Ristić,et al.  Sensor Technology and Devices , 1994 .

[33]  M. Esashi,et al.  Vacuum packaging for microsensors by glass-silicon anodic bonding , 1994 .

[34]  K. Fluri,et al.  Micromachining Chemical And Biochemical Analysis And Reaction Systems On Glass Substrates , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.

[35]  B. Roberds,et al.  Chemical Free Room Temperature Wafer To Wafer Direct Bonding , 1995 .

[36]  T. Rogers,et al.  Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors , 1995 .

[37]  M. Schmidt,et al.  A merged MEMS-CMOS process using silicon wafer bonding , 1995, Proceedings of International Electron Devices Meeting.

[38]  Jan H. J. Fluitman,et al.  Sacrificial wafer bonding for planarization after very deep etching , 1995 .

[39]  Nghia Chiem,et al.  Micromachinng chemical and biochemical analysis and reaction systems on glass substrates , 1996 .

[40]  J. M. Noworolski,et al.  Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures , 1996 .

[41]  Albert P. Pisano,et al.  Batch transfer of microstructures using flip-chip solder bump bonding , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[42]  Takayuki Yagi,et al.  A New Method to Fabricate Metal Tips for Scanning Probe Microscopy , 1997 .

[43]  Daniel Sobek.  Microfabricated fused silica flow chambers for flow cytometry , 1997 .

[44]  Room temperature silicon wafer direct bonding in vacuum by Ar beam irradiation , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.

[45]  Paul Jaramillo,et al.  Bond-quality characterization of silicon-glass anodic bonding , 1997 .

[46]  J. O. Mur-Miranda,et al.  Power MEMS and microengines , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[47]  U. D Larsen,et al.  Microchip Coulter particle counter , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[48]  U. Gösele,et al.  Semiconductor wafer bonding , 1990 .