High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology
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[1] R. Ramesham,et al. Challenges in interconnection and packaging of microelectromechanical systems (MEMS) , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
[2] Jennie S. Hwang. Solder Paste in Electronics Packaging , 1989 .
[3] Laura J. Evans. High Temperature Electronics for Intelligent Harsh Environment Sensors , 2008 .
[4] G. Krotz,et al. A high temperature pressure sensor with /spl beta/-SiC piezoresistors on SOI substrates , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[5] Y. C. Chan,et al. Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging , 2005 .
[7] Rymantas Kažys,et al. High temperature ultrasonic transducers: review , 2008 .
[8] Nduka Nnamdi (Ndy) Ekere,et al. Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[9] R. Durairaj,et al. A Study of Inter-Metallic Compounds (IMC) Formation and Growth in Ultra-Fine Pitch Sn-Ag-Cu Lead-Free Solder Joints , 2006, 2006 1st Electronic Systemintegration Technology Conference.
[10] S. Mannan,et al. Study of intermetallic crystal growth between Nb and molten 52In-48Sn solder , 2005 .
[11] Robert S. Okojie,et al. Operation of /spl alpha/(6H)-SiC pressure sensor at 500/spl deg/C , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[12] W.D. Brown,et al. Challenges in the packaging of MEMS , 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
[13] S. D. Senturia. Microsensors vs. integrated circuits: a study in contrasts , 1989, International Technical Digest on Electron Devices Meeting.
[14] Tom Baird,et al. High-Pressure , High-Temperature Well Logging , Perforating and Testing , 2004 .
[15] J. Shen,et al. Research advances in nano-composite solders , 2009, Microelectron. Reliab..
[16] Martin Eickhoff,et al. Silicon compatible materials for harsh environment sensors , 1999 .
[17] S. Mannan,et al. Materials and processes for implementing high-temperature liquid interconnects , 2004, IEEE Transactions on Advanced Packaging.
[18] Richard C. Kullberg. Processes and materials for creating and maintaining reliable vacuum and other controlled atmospheres in hermetically sealed MEMS packages , 1999, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[19] M. N. Nguyen,et al. Low stress polymer die attach adhesive for plastic packages , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.
[20] Janusz Bryzek,et al. Low-cost, high-volume packaging techniques for silicon sensors and actuators , 1988, IEEE Technical Digest on Solid-State Sensor and Actuator Workshop.
[21] Richard Ulrich,et al. Advanced electronic packaging , 2006 .
[22] Gunnar DeBruijn,et al. High-Pressure , High-Temperature Technologies , 2009 .