Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure

[1]  K. Suganuma,et al.  Sn whisker growth during thermal cycling , 2011 .

[2]  Katsuaki Suganuma,et al.  Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes , 2011 .

[3]  K. Suganuma,et al.  Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper , 2011 .

[4]  兼治 隅山,et al.  Sn-Ag 合金めっき膜の熱処理による外部応力誘起 Sn ウィスカ発生の抑制効果 , 2009 .

[5]  Y. C. Ding,et al.  The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment , 2009, Microelectron. Reliab..

[6]  Douglas G. Ivey,et al.  Room temperature interfacial reactions in electrodeposited Au/Sn couples , 2008 .

[7]  Sayoon Kang,et al.  Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling , 2007, Microelectron. Reliab..

[8]  M. Nakamura,et al.  Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating , 2007, IEEE Transactions on Electronics Packaging Manufacturing.

[9]  Junxiang Jiang,et al.  Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers , 2007 .

[10]  Y. L. Lin,et al.  Tin Whisker Growth Induced by High Electron Current Density , 2007, 2007 International Microsystems, Packaging, Assembly and Circuits Technology.

[11]  Junxiang Jiang,et al.  Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging , 2007 .

[12]  T. Furusawa,et al.  Microstructure of External Stress Whiskers and Mechanical Indentation Test Method , 2007 .

[13]  M. G. Norton,et al.  The influence of porosity on whisker growth in electroplated tin films , 2006 .

[14]  K. Suganuma,et al.  Suppression of tin whisker formation on fine pitch connectors by surface roughening , 2006 .

[15]  King-Ning Tu,et al.  Spontaneous whisker growth on lead-free solder finishes , 2005 .

[16]  Gery R. Stafford,et al.  Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits , 2005 .

[17]  S. H. Liu,et al.  Tin whisker growth driven by electrical currents , 2004 .

[18]  Alastair A. MacDowell,et al.  Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction , 2003 .

[19]  Dong Nyung Lee,et al.  Spontaneous growth mechanism of tin whiskers , 1998 .

[20]  Z. Marinković,et al.  Room temperature interactions in Pd-metal thin film couples , 1997 .

[21]  K. Tu.  Cu/Sn interfacial reactions: thin-film case versus bulk case , 1996 .

[22]  Michael G. Pecht,et al.  The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth , 2007, Microelectron. Reliab..

[23]  Katsuaki Suganuma,et al.  Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems , 2006 .