Continuously thermal conductive pathway of bidisperse boron nitride fillers in epoxy composite for highly efficient heat dissipation
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G. Yi | Gaehang Lee | Sung-Jin Chang | K. Nam | J. Cho | M. Kim | SangGap Lee | Sun Ha Kim | L. S. Kim | Kyuseok Choi | Daewoong Jung | Joon Yong Park | Jun Min Kim | S. Jeong