论文信息 - Heat and strain-sensitive thin-film transducers

Heat and strain-sensitive thin-film transducers

Abstract Thin-film technologies for heat and strain sensing show considerable promise for direct integration with silicon integrated circuits. When combined with on-chip processing of silicon micromechanical structures, wholly new design options for sensing systems can be considered. Miniature bolometers, thermocouple arrays and pyroelectric heat sensors are suitable thin-film heat sensors. Metallic and polycrystalline silicon piezoresistors, electrets and piezoelectric films are candidates for IC-compatible strain sensors. Features of the technology for r.f.-sputtered ZnO films on silicon are described.

Richard S. Muller

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