论文信息 - Packaging issues for free-space optically interconnected multiprocessors

Packaging issues for free-space optically interconnected multiprocessors

The technical feasibility and the performance of packaged systems with free space optical interconnections for parallel computing are analyzed. System issues such as volume power consumption optical properties of interconnection elements yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.

Sadik C. Esener | Sing H. Lee | Volkan H. Ozguz

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