Development of RF/microwave on-chip inductors using an organic micromachining process
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[1] Anh-Vu Pham,et al. RF/microwave characterization of multilayer ceramic-based MCM technology , 1999 .
[2] K. Jenkins,et al. Microwave inductors and capacitors in standard multilevel interconnect silicon technology , 1996 .
[3] J. Malinowski,et al. High Q inductors in a SiGe BiMOS process utilizing a thick metal process add-on module , 1999, Proceedings of the 1999 Bipolar/BiCMOS Circuits and Technology Meeting (Cat. No.99CH37024).
[4] Jun-Bo Yoon,et al. Surface micromachined solenoid on-Si and on-glass inductors for RF applications , 1999, IEEE Electron Device Letters.
[5] L.W. Pearson,et al. Membrane-supported Ka band resonator employing organic micromachined packaging , 2000, 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017).
[6] E. A. Logan,et al. Wafer-level chip scale packaging: benefits for integrated passive devices , 2000, ECTC 2000.