Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions
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[1] Sinn-wen Chen,et al. Electric current effects on Sn/Ag interfacial reactions , 1999 .
[2] A. G. Guy,et al. Electromigration in gold-silver alloys , 1972 .
[3] C. Kao. Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples , 1997 .
[4] S. J. Krumbein,et al. Metallic electromigration phenomena , 1988 .
[5] V. I. Dybkov,et al. Determination of NiBi3 reaction-diffusion constants in Ni-Bi couples , 1995 .
[6] M. Togo,et al. Repair of Electromigration-Induced Voids in Aluminum Interconnection by Current Reversal , 1993 .
[7] Z. Marinković,et al. Metallurgical and protective coatingsRoom temperature interactions in Ni/metal thin film couples , 1982 .
[8] H. B. Huntington. 6 – Electromigration in Metals , 1975 .
[9] H. B. Huntington,et al. Electromigration of copper in lead , 1978 .
[10] A. Lodding,et al. Current induced motion of lattice defects in indium metal , 1965 .
[11] H. B. Huntington,et al. A study of electromigration of nickel in lead , 1978 .
[12] J. W. Morris,et al. The metallurgical control of electromigration failure in narrow conducting lines , 1996 .
[13] S. Chua,et al. Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer , 1997 .
[14] V. I. Dybkov,et al. GROWTH KINETICS OF COMPOUND LAYERS AT THE NICKEL-BISMUTH INTERFACE , 1996 .
[15] R. Penney. Current-induced mass transport in aluminum☆ , 1964 .
[16] H. B. Huntington,et al. Electromigration of gold and silver in single crystal tin , 1987 .
[17] H. B. Huntington,et al. Diffusion and electromigration of silver and nickel in lead-tin alloys , 1982 .
[18] Sinn-wen Chen,et al. Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions , 1998 .
[19] H. B. Huntington,et al. Electromigration of cadmiun in lead , 1981 .
[20] I. Ames,et al. Reduction of electromigration in aluminum films by copper doping , 1970 .
[21] Masami Onishi,et al. On the Reversed Concentration Layer Formed in Ni-Zn Reaction Diffusion Couples , 1981 .
[22] Bi-Shiou Chiou,et al. Electromigration in sputtered copper films on polyimide , 1999 .
[23] Z. Marinković,et al. Room temperature interactions in Te/metal thin film couples , 1979 .
[24] A. Lodding. Electrotransport and effective self-diffusion in pure liquid gallium metal , 1966 .
[25] A. Nowick,et al. Diffusion in solids: recent developments , 1975 .
[26] S. Gearhart,et al. Ultra-shallow P+/N junctions formed by recoil implantation , 1998 .
[27] K. Sawada,et al. Electromigration in AlSiCu/TiN/Ti interconnects with Ti and TiN additional layers , 1994 .
[28] Thomas Kwok,et al. Electromigration and reliability in submicron metallization and multilevel interconnection , 1993 .
[29] N. V. Doan. Effet de valence en electromigration dans l'argent , 1970 .
[30] A. Grone. Current-induced marker motion in copper , 1961 .
[31] C-K. Hu,et al. Electromigration in two-level interconnects of Cu and Al alloys , 1995 .
[32] R. Hummel. Electromigration and related failure mechanisms in integrated circuit interconnects , 1994 .
[33] A. L. Greer,et al. Transmission electron microscopy of AlCu interconnects during in-situ electromigration testing , 1997 .
[34] Lawrence H. Bennett,et al. Binary alloy phase diagrams , 1986 .
[35] L. Borucki,et al. A new investigation of copper's role in enhancing Al-Cu interconnect electromigration resistance from an atomistic view , 1999 .
[36] J. Hirth,et al. A theory of multiphase binary diffusion , 1976 .