Synthesis of low viscosity, fast UV curing solder resist based on epoxy resin for ink‐jet printing
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[1] Feng Gao,et al. Large area, high resolution, dry printing of conducting polymers for organic electronics , 2003 .
[2] C. Ramírez,et al. Study of an epoxy system cured with different diamines by differential scanning calorimetry , 2007 .
[3] F. Sun,et al. Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask , 2010 .
[4] M. Frigione,et al. UV-curable epoxy systems containing hyperbranched polymers: Kinetics investigation by photo-DSC and real-time FT-IR experiments , 2009 .
[5] R. Hester,et al. Intrinsic viscosity dependence on polymer molecular weight and fluid temperature , 2003 .
[6] Kyung Hyun Choi,et al. Development and ejection behavior of different material-based electrostatic ink-jet heads , 2010 .
[7] R. Bruce Prime,et al. Differential scanning calorimetry of the epoxy cure reaction , 1973 .
[8] I. Krieger,et al. Direct Determination of the Flow Curves of Non‐Newtonian Fluids. IV. Parallel‐Plane Rotational Viscometer , 1966 .
[9] J. Horský,et al. Ionomers in low-polarity solvents , 1991 .
[10] E. Kley,et al. Development of a novel, low-viscosity UV-curable polymer system for UV-nanoimprint lithography , 2007 .
[11] A. Calster,et al. Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes , 2005 .
[12] S. Leppävuori,et al. Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications , 2004 .
[13] Kuo-Ning Chiang,et al. Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages , 2002 .
[14] A. Ehrlich,et al. Allergic contact dermatitis from epoxy resin in solder mask coating in an individual working with printed circuit boards. , 2010, Dermatitis : contact, atopic, occupational, drug.
[15] Junsheng Yu,et al. Synthesis and sensitive properties of poly‐(bistriethylphosphine)‐platinum‐diethynylbenzene for organic vapor detection , 2010 .