30–512 MHz power amplifier design using GaN transistor

In this article a class AB single-ended power amplifier with 30-512 MHz frequency band and 100 W saturated output power has been designed and implemented using a GaN transistor. The measured compressed gain is 196 1 dB, the average PAE is 61% and the return loss is always better than 27.5 dB.

[1]  Gamal M. Hegazi,et al.  Circuit and EM modeling of wideband high power VHF-UHF combiners , 2009 .

[2]  Howard N. Shapiro,et al.  Introduction to Thermal Systems Engineering: Thermodynamics, Fluid Mechanics, and Heat Transfer , 2002 .

[3]  W. Curtice A MESFET Model for Use in the Design of GaAs Integrated Circuits , 1980 .

[4]  A. Fathy,et al.  DEVELOPMENT OF A WIDEBAND HIGHLY EFFICIENT GAN VMCD VHF/UHF POWER AMPLIFIER , 2011 .

[5]  Geok Ing Ng,et al.  Active current modeling for GaN HEMT devices , 2015 .

[6]  Gordon N. Ellison,et al.  Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling , 2010 .

[7]  Marcel Abendroth Handbook Of Rf And Microwave Power Amplifiers , 2016 .

[8]  Franco Giannini,et al.  Evaluation of GaN technology in power amplifier design , 2009 .

[9]  K. Ng,et al.  The Physics of Semiconductor Devices , 2019, Springer Proceedings in Physics.

[10]  Zoya Popovic,et al.  Decade bandwidth high-efficiency GaN VHF/UHF power amplifier , 2013, 2013 IEEE MTT-S International Microwave Symposium Digest (MTT).

[11]  Steve C. Cripps,et al.  Advanced Techniques in RF Power Amplifier Design , 2002 .

[12]  S. Sze,et al.  Physics of Semiconductor Devices: Sze/Physics , 2006 .

[13]  R. Vetury,et al.  100 W GaN HEMT power amplifier module with > 60% efficiency over 100–1000 MHz bandwidth , 2010, 2010 IEEE MTT-S International Microwave Symposium.

[14]  C. Gaquière,et al.  Effects of high temperature on the electrical behavior of AlGaN/GaN HEMTs , 2002 .

[15]  Steven,et al.  The New Power Brokers: high VolTage rF DeVices , 2009 .

[16]  M. Yovanovich,et al.  Four decades of research on thermal contact, gap, and joint resistance in microelectronics , 2005, IEEE Transactions on Components and Packaging Technologies.

[17]  S. C. Cripps,et al.  RF Power Amplifiers for Wireless Communications , 1999 .