Recent advances in TSV inductors for 3D IC technology
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[1] Bruce C. Kim,et al. Development of TSV-based inductors in power electronics packaging , 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
[2] Jonghae Kim,et al. High-Q 3D RF solenoid inductors in glass , 2014, 2014 IEEE Radio Frequency Integrated Circuits Symposium.
[3] K. Yoshida,et al. Design of 3D integrated inductors for RFICs , 2012, 2012 Japan-Egypt Conference on Electronics, Communications and Computers.
[4] Rao Tummala,et al. Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages , 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
[5] Saikat Mondal,et al. A novel TSV inductor structure for RF applications , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
[6] Saikat Mondal,et al. Tunable 3D TSV-based inductor for integrated sensors , 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).