Phase-change immersion cooling high power light emitting diodes and heat transfer improvement

Abstract A new cooling method of ethanol direct-contact phase-change immersion cooling was proposed in the thermal management of high power light emitting diodes (LED) and the feasibility of this cooling method was investigated. The heat generated by LED was measured firstly using two types of power systems: DC power and LED driver. Then the heat dissipation performance was evaluated under different experimental conditions. The results indicate that startup process of the cooling system is quick and only 450 s is needed to reach steady-state under heat load of 42.78 W. The minimum thermal resistance of 1.233 °C/W is obtained when liquid filling ratio is 33.14%. The junction temperature of LED under different absolute pressures is much lower than the limited value of 120 °C. Baffle with total height of 140 mm, bottom space height of 20 mm and distance away from substrate surface of LED of 8 mm improves heat transfer performance best due to ethanol self-circulating in the cooling receiver. Overall, the ethanol phase-change immersion cooling is an effective way to make sure high power LED work reliably and high efficiently.

[1]  Miao Cai,et al.  An experimental investigation of a 100-W high-power light-emitting diode array using vapor chamber–based plate , 2015 .

[2]  Takashi Mukai,et al.  White LEDs for solid state lighting , 2004, SPIE Optics + Photonics.

[3]  N. Narendran,et al.  Life of LED-based white light sources , 2005, Journal of Display Technology.

[4]  Bin Liu,et al.  A high power LED device with chips directly mounted on heat pipes , 2014 .

[5]  Anas El Maakoul,et al.  Numerical design and investigation of heat transfer enhancement and performance for an annulus with continuous helical baffles in a double-pipe heat exchanger , 2017 .

[6]  Shuncong Zhong,et al.  Sine-modulated wavelength-independent full-range complex spectral optical coherence tomography with an ultra-broadband light source , 2015 .

[7]  Tian Jian Lu,et al.  Thermal management of high power electronics with phase change cooling , 2000 .

[8]  Jong Hwa Choi,et al.  Thermal analysis of LED array system with heat pipe , 2007 .

[9]  H. Liem,et al.  Thermal investigation of a high brightness LED array package assembly for various placement algorithms , 2014 .

[10]  Jing Liu,et al.  A liquid metal cooling system for the thermal management of high power LEDs , 2010 .

[11]  G. P. Peterson,et al.  Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays , 2013 .

[12]  Zhenxing Li,et al.  Numerical study of turbulent flow and heat transfer in cross-corrugated triangular ducts with delta-shaped baffles , 2017 .

[13]  Yan Wang,et al.  A novel automated heat-pipe cooling device for high-power LEDs. , 2017 .

[14]  Kai-Shing Yang,et al.  Thermal characterization of shrouded plate fin array on an LED backlight panel , 2011 .

[15]  Tsung-Yi Yang,et al.  A novel flat polymer heat pipe with thermal via for cooling electronic devices , 2015 .

[16]  Wei Yuan,et al.  Experimental investigation of a PCM-HP heat sink on its thermal performance and anti-thermal-shock capacity for high-power LEDs , 2016 .

[17]  Yaping Chen,et al.  Impact of helical baffle structure on heat transfer performance of vertical condensers , 2017 .

[18]  Qunwu Huang,et al.  Study on direct-contact phase-change liquid immersion cooling dense-array solar cells under high concentration ratios , 2016 .

[19]  Zirong Lin,et al.  Heat transfer characteristics and LED heat sink application of aluminum plate oscillating heat pipes , 2011 .

[20]  Hsueh-Han Wu,et al.  A study on the heat dissipation of high power multi-chip COB LEDs , 2012, Microelectron. J..

[21]  S. F. Sufian,et al.  Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink , 2017, Microelectron. Reliab..

[22]  Sheng Liu,et al.  Thermal analysis and optimization of multiple LED packaging based on a general analytical solution , 2010 .

[23]  Yan-Ping Wang,et al.  Thermal analysis of high power LED package with heat pipe heat sink , 2011, Microelectron. J..

[24]  Chun Zhang,et al.  Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package , 2015 .

[25]  Huan-Liang Tsai,et al.  Self-sufficient energy recycling of light emitter diode/thermoelectric generator module for its active-cooling application , 2016 .

[26]  Lin Wang,et al.  Active-passive combined and closed-loop control for the thermal management of high-power LED based on a dual synthetic jet actuator , 2017 .

[27]  Kai-Shing Yang,et al.  Performance and two-phase flow pattern for micro flat heat pipes , 2014 .

[28]  Daming Wang,et al.  A loop-heat-pipe heat sink with parallel condensers for high-power integrated LED chips , 2013 .

[29]  Stéphane Lips,et al.  Combined effects of the filling ratio and the vapour space thickness on the performance of a flat plate heat pipe , 2010 .

[30]  Shou-Shing Hsieh,et al.  A microspray-based cooling system for high powered LEDs , 2014 .

[31]  Han Seo Ko,et al.  Development of heat sink with ionic wind for LED cooling , 2016 .