Mult i-wire Microst rip Interconnect ions: Analysis for the Extraction of an Equivalent Circuit

[1]  Nathan Marcuvitz Waveguide Handbook , 1951 .

[2]  T. Krems,et al.  Millimeter-wave performance of chip interconnections using wire bonding and flip chip , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[3]  William H. Press,et al.  Numerical recipes , 1990 .

[4]  Jifu Huang,et al.  Rigorous analysis of mixed transmission line interconnects using the frequency-domain TLM method , 1993 .

[5]  Peter Russer,et al.  Flip-chip and bond wire/airbridge transitions between passive microwave transmission lines and laser diodes , 1995, 1995 25th European Microwave Conference.

[6]  U. Goebel DC to 100 GHz chip-to-chip interconnects with reduced tolerance sensitivity by adaptive wirebonding , 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

[7]  Antti V. Räisänen,et al.  Application of a simple and efficient source excitation technique to the FDTD analysis of waveguide and microstrip circuits , 1996 .

[8]  Tzyy-Sheng Horng A rigorous study of microstrip crossovers and their possible improvements , 1994 .

[9]  R. Sorrentino,et al.  A simple way to model curved metal boundaries in FDTD algorithm avoiding staircase approximation , 1995 .

[10]  S. Gedney An anisotropic perfectly matched layer-absorbing medium for the truncation of FDTD lattices , 1996 .

[11]  L. Roselli,et al.  On the accuracy of the finite-difference method using mesh grading , 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.

[12]  Uhland Goebel,et al.  Low Cost Packages for Micro- and Millimeterwave Circuits , 1994, 1994 24th European Microwave Conference.

[13]  Nicolaos G. Alexopoulos,et al.  Frequency-independent equivalent circuit model for microstrip open-end and gap discontinuities , 1994 .

[14]  K. Yee Numerical solution of initial boundary value problems involving maxwell's equations in isotropic media , 1966 .

[15]  L. Roselli,et al.  Full-wave investigation on the curved bonding wire interconnection by using a suitable FDTD code , 1997, 1997 IEEE MTT-S International Microwave Symposium Digest.