A Band-Engineered One-Transistor DRAM With Improved Data Retention and Power Efficiency

In this letter, a one-transistor (1T) dynamic random-access memory (DRAM) with SiGe quantum well (QW) is proposed, and its performance is validated through the technology computer-aided design (TCAD) simulation. At the write operation, band-to-band tunneling is used and 1 V or lower programming voltage is realized by inserting the SiGe QW beside the drain. This QW also functions as the storage node, which enhances not only the current sensing margin but also the retention time (<inline-formula> <tex-math notation="LaTeX">$\tau _{{\text {ret}}}$ </tex-math></inline-formula>) compared with those of all-Si device. At an extremely scaled cell size and sub-10-ns write/erase operations, the proposed device shows 0.2-s-long <inline-formula> <tex-math notation="LaTeX">$\tau _{{\text {ret}}}$ </tex-math></inline-formula> and current ratio > 10<sup>4</sup>. It has been verified that a single cycle of 1T DRAM operations consumes only 93.8 fJ.

[1]  Evaluation of Interface Trap Density in a SiGe/Si Heterostructure Using a Charge Pumping Technique and Correlation Between the Trap Density and Low Frequency Noise in SiGe-Channel pMOSFETs , 2002, 32nd European Solid-State Device Research Conference.

[2]  S. Okhonin,et al.  A capacitor-less 1T-DRAM cell , 2002, IEEE Electron Device Letters.

[3]  T. Tanaka,et al.  A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory , 2006, IEEE Transactions on Electron Devices.

[4]  Seongjae Cho,et al.  Ultrathin SiGe Shell Channel p-Type FinFET on Bulk Si for Sub-10-nm Technology Nodes , 2018, IEEE Transactions on Electron Devices.

[5]  Man Young Sung,et al.  A Nonvolatile Refresh Scheme Adopted 1T-FeRAM for Alternative 1T-DRAM , 2008 .

[6]  A. Kranti,et al.  Vertical Transistor With n-Bridge and Body on Gate for Low-Power 1T-DRAM Application , 2017, IEEE Transactions on Electron Devices.

[7]  Tsu-Jae King,et al.  A capacitorless double gate DRAM technology for sub-100-nm embedded and stand-alone memory applications , 2003 .

[8]  Byung-Gook Park,et al.  Design and Electrical Characterization of 2-T Thyristor RAM With Low Power Consumption , 2018, IEEE Electron Device Letters.

[9]  裕幸 飯田,et al.  International Technology Roadmap for Semiconductors 2003の要求清浄度について - シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について - , 2004 .

[10]  Jin-Woo Han,et al.  Energy band engineered unified-RAM (URAM) for multi-functioning 1T-DRAM and NVM , 2008, 2008 IEEE International Electron Devices Meeting.

[11]  Minsu Choi,et al.  Dynamic Temperature Aware Scheduling for CPU-GPU 3D Multicore Processor with Regression Predictor , 2018 .

[12]  T. Tsuchiya,et al.  High Ge fraction intrinsic SiGe-heterochannel MOSFETs with embedded SiGe source/ drain electrode formed by in-situ doped selective CVD epitaxial growth , 2008 .

[13]  Adrian M. Ionescu,et al.  Tunnel field-effect transistors as energy-efficient electronic switches , 2011, Nature.

[14]  P. Kapur,et al.  A Highly Scalable Capacitorless Double Gate Quantum Well Single Transistor DRAM: 1T-QW DRAM , 2008, IEEE Electron Device Letters.

[15]  Stephen Wu,et al.  A new observation of the germanium outdiffusion effect on the hot carrier and NBTI reliabilities in sub-100nm technology strained-Si/SiGe CMOS devices , 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..

[16]  Ki-Seok Chung,et al.  DRBAC: Dynamic Row Buffer Access Control for Power and Performance of DRAM Systems , 2018 .

[17]  John C. Bean,et al.  Modulation doping in GexSi1−x/Si strained layer heterostructures , 1984 .